China Job Listing

Director RFIC Design

Location: S.J. USA

Chinese speaker is requested

Our client is a pre-IPO fabless semiconductor company developing next generation networking systems based on RFIC technologies. They need a talented designer/leader to lead a team developing RF and analog/mixed-mixed signal ICs for wireless transceiver applications. Reports directly to VP of Engineering and takes technical direction for product development from the CTO. Ideal candidate wants to be VP of Engineering and is ready now.

Specific duties:

Lead position for RFIC design team. Involved in all aspects of the development including: chip architecture, circuit design, simulation, CAD, system architecture and specifications, device modeling, layout, packaging and test.
Demonstrated experience in developing IEEE 802.11 RF ICs and other wireless transceivers that have shipped in high volume.
In-depth RF semiconductor knowledge of circuit elements including low noise amps, high efficiency power amps, VCOs, synthesizer loops, filtering, RF receivers and transmitters, various Op Amp topologies and apps.
In-depth knowledge and experience designing baseband sections of wireless transceivers.
Knowledge and experience with RFCMOS, BiCMOS and SiGE technology, including foundry process and packaging.
Budget and manpower loading.
Directly managed groups of 10 or more engineers in a mixed signal environment.

Ten years of experience as a member of a fast-paced engineering team.
Masters and/or PhD in EE.

Compensation is very competitive includes: salary, bonus and stock.

please send your cover letter and resume to topjob_eos001@dacare.com