China Job Listing

Company Introduction:
top semiconductor manufacturing company

Responsibilities:
1. Process sustaining
-Yield improvement
-Daily hold lot disposition
-Training for fresh process engineer
-Lead the CIP team focusing on major process issue.
-Follow up customer concerns and implement in process control
-Follow up customer audit and transfer customer spec.

2. Qual/NPI lot handling
-Handle customer qual lot building
-Follow up customer requirements
-Report to customer for the concerned questions

Position definition:
-FOL and EOL process engineer leader for each

Requirements:
FOL PE 1per
-Oversea process engineering base on IC assembly and test.
- At least 3 years working experience in IC assembly.
-FOL process engineer shall well know quality control system
-FOL process engineer shall well know for back grinding, Die sawing, Die bond and wire bond.
-FOL process engineer shall well know Disco, ESEC, UTC,KNS and ASM machines.
-Well know DOE knowledge, can use JUMP or Minitab software for process optimization
-Well know IC parts assembly and test requirements.
-Well know wafer mapping system
-Skillful English speaking, writing and listening

EOL PE 1per
-Oversea process engineering base on IC assembly and test.
- At least 3 years working experience in IC assembly.
-EOL process engineer shall well know package outlines drawing and international standards.
-Well know for Mold & TNF mechanism and process control
-Well know for mechanical defect analysis and make CIP.
-Well know molding process control and mold compound
-Well know project handling such as green compound evaluation
-Well know package level reliability test and contiously meet customer requirement
-Well know DOEs, such as JUMP or Minitab.
-Well know cusomer spec review and transfer to internal spec.
-Well know quality control system.
-Skillful English speaking, writing and listening.

* Please send us your complete resume (both in Chinese and in English) to: 'topjob_ic050sh@dacare.com'